PTC- Creating and Enabling Your Semiconductor Factory Solutions

At PTC we don’t just have theoretical knowledge, we are hands on semiconductor assembly, packaging, test, and business development experts that can bring you factory solutions to life.

A Growing Need For Semiconductor Factories

162%

Estimated Semiconductor Industry Growth by 2029

56%

Demand For Manufacturing Capacity to Increase

53 billion

Invested by U.S. Government in Semiconductor Industry by 2030.

Global Investment

High Global Private & Government Investment in Emerging Semiconductor Markets such as India

“ Our goal at PTC is to develop and optimize the semiconductor ecosystem globally and especially in emerging tech markets. “

Raja Manickam, Founder

Factory & Business Services

Factory

Factory Layout and Environment Controls

Quality Assurance and Control Implementation

Equipment Procurement and Installation

Technology Transfer Planning

Package Design and Bill of Material Selection

Process Development and Optimization

Product and Process Qualification

Production Scaling & High-Volume Manufacturing Ramp

Factory Build–Operate–Transfer

Factory Certification

Supply Chain Development and Optimization

Workforce Setup and Training

Business

Semiconductor Product Ecosystem Consulting: Monetize, Manufacture, and Deliver

Risk Assessment and Risk Mitagation

Sales and Business Development Support

Government and Private Partnership Development

Factory Due Diligence and Auditing Services

Cost Models

Industries & Applications Expertise

Our Consultants have supported various Industries and Applications including the ones below.

RF

Automotive

Solar

Micro-Controllers

Memory

LED

Power

Sensor

Roadmap of Packages Supported by Our Consultants

SOT

DIP

TSOP

PLCC

LQFP / TQFP

QFP

HSBGA

LBGA

PBGA

BGA Stack Die

Diode package for Solar application

Solar CPV Module

QFN Stack Die Flash die stack on IC

QFN

PQFN – Cu Clip Exposure Copper

FCBGA

SIP LGA

SIP- QFN

uSD

SD Card

USB

Auto Front Lighting Micro-LED

Double Sided Molding

Wettable flank QFN

Smart Card

Package/Product Experience Examples

IC Package Legacy Product

PLCC Families

SOIC Families

SOT Families

TO Families

SOP Families

QFP Families

TSOP Families

QFN module (stack Die)

- - Typically having flash memory die (EEPROM) stacked on controller die.
  - Options of multiple controller for increased functionality.

Power QFN Package

Single Cool

Dual Cool

- - Power QFN combined with copper clip replaces the traditional wire bond interconnect for high performance MOSFETs by providing lower resistance and inductance than multiple wire bonds to improve thermal performance.
  - Options of Single-Cool (embedded Cu clip) and Dual-Cool (expose Cu clip).

Memory Devices

- - Different variance of memory packages : TSOP, micro-SD, SD Card and USB.
  - Multiple stack NAND die with different technology with thickness up to 4 stack.

CMOS Image Sensor Product

- - CMOS Image Sensor with different platform of CLCC (Ceramic) and iBGA (laminate substrate).
  - Commonly used in automotive, unattended surveillance, stereo vision, security, smart vision, automation, and machine vision.

BGA with Expose Heat Spreader

- - Heat spreader attached on top of punch BGA for improved thermal performance.
  - Typically used on a device having high thermal conductivity that is used to move heat from a concentrated or high heat flux source to a heat exchanger with a larger cross section area, surface area, and volume.

Power QFN/LGA/BGA Module with Thick Component (5mm thickness package)

- - Controller IC die/package with typical passive component & large component such as an inductor.
  - Substrate interposer to improve circuit routabality.
  - Multiple copper wires and/or Al ribbon for power application.
  - SIP integration to improve device functionality and performance.

RF SIP LGA/ BGA Module with COB

- - Multi die LGA module with passive component for QFN application.
  - Key Features:
    - Compact design
    - Short wire length
    - Cost efficient

RF SIPLGA/ DSMBGA Module with SMT + MCOB

- - Double Sided Molded Ball Grid Array (DSMBGA) package which allows molded assembly of components on both sides of the substrate.
  - SIP module is a package that contains an electronic system or sub-system and is miniaturized through IC assembly.

Careers at PTC

Join our consulting team and bring your expertise to PTC.

Careers

Your Trusted Semiconductor Factory Expert

Need a trusted semiconductor factory expert? With an average experience level of 30+ years in assembly, packaging, test, and business development, there’s not much our consultants haven’t seen. Tell us about your needs and we’ll let you know how we can support you!